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| EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC FEATURES * * * * * * 6 - 18 GHz Operating Frequency Range 33 dBm Output Power at 1dB Compression 20.0 dB Typical Small Signal Gain Point-to-point and point-to-multipoint radio Military Radar Systems Test systems Dimension: 5330um X 3080um Thickness: 85um 15um APPLICATIONS Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25C, 50 ohm, VDD=8V, IDQ=1250mA) SYMBOL F P1dB GSS G ID1dB PAE OIMD3 Input RL Output RL IDSS RTH PARAMETER/TEST CONDITIONS Operating Frequency Range Output Power at 1dB Gain Compression Small Signal Gain Small Signal Gain Flatness Supply current at 1dB Gain Compression Power Added Efficiency at 1dB Gain Compression Output 3rd Order Intermodulation Distortion @f=10MHz, Each Tone Pout 21.5dBm Input Return Loss 6GHz - 8GHz 8GHz - 18GHz Output Return Loss Saturated Drain Current VDD=3V, VGG=0V MIN 6 31 17 33 20 1.2 1400 20 -43.0 -8 -12 -15 2500 5.5 o TYP MAX 18 UNITS GHz dBm dB dB mA % dBc -5 -8 -10 dB dB dB mA C/W Thermal Resistance (Au-Sn Eutectic Attach) ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION1 SYMBOL VDS VGS IDD IGSF PIN TCH TSTG PT CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation VALUE 8V - 4V Idss 70 mA @ 3dB compression 175C -65/175C 22W 1. Operating the device beyond any of the above rating may result in permanent damage. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Typical Performance Characteristics All data measured at 8V, IDQ=1250mA bias, 25C unless otherwise noted. Output Power at 1dB gain compression over temperature 35 34 O u tp u t P o w er, d Bm Gain over Temperature 24 23 22 21 G ain , d B 33 32 -40C 20 19 18 -40C +25C +80C 31 30 6 8 10 12 Frequency, GHz +25C +80C 17 16 15 6 14 16 18 8 10 12 Frequency, GHz 14 16 18 Output Power at 1dB and 2dB gain compression 35 PAE at 1dB and 2dB gain compression 25 34 20 Output Power, dBm PAE % 33 15 32 10 PAE1dB 31 5 P1dB PAE2dB P2dB 30 6 8 10 12 Frequency, GHz 14 16 18 0 6 8 10 12 Frequency, GHz 14 16 18 Output Power at 1dB gain compression vs Vdd, Iq = 1250mA 34 33 25 24 23 G ain , d B Gain vs Vdd, Iq = 1250mA 8V 7V 6V 5V O u tp u t P o w er, d B m 32 31 30 29 28 6 8 22 21 20 19 8V 7V 6V 5V 10 12 Freuquency, GHz 14 16 18 6 8 10 12 Frequency, GHz 14 16 18 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Output Power at 1dB Gain Compression vs Iq, Vdd=8V 35 34 O u tp u t P o w er, d Bm 33 G ain , d B Gain vs Iq, Vdd = 8V 22.5 22 21.5 21 20.5 20 19.5 19 1500mA 1250mA 1000mA 32 31 1500mA 30 29 28 6 8 10 12 Frequency, GHz 14 16 18 1250mA 1000mA 6 8 10 12 Frequency, GHz 14 16 18 0 Input and Output Return Loss DB(|S(1,1)|) -20 IM3 over temperature Pout=21.5dBm/tone -5 Return Gain, dB DB(|S(2,2)|) -40C -25 -30 IM 3, d Bc +25C +80C -10 -35 -40 -15 -20 -45 -50 -25 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20 22 6 8 10 12 Frequency, GHz 14 16 18 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Outline Drawing 2441 3487 1223 1513 1882 2192 3118 854 4134 93 232 4387 601 3080 2990 2916 2414 1714 1372 649 90 0 164 2192 1882 2441 3118 0 601 1513 3487 4134 854 1223 4387 232 Dimensions in microns. Bond pad size 100um x 100um. Thickness: 85um 15um Assembly Drawing VGG .1uF .1uF VDD 50pF Cap, x12 IN Gold plated ridge OUT Stand-off, x4 .1uF .1uF VGG VDD Page 4 of 5 Revision 03 Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com 5242 5330 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Application Hints Biasing The EMP216 requires a negative bias voltage applied to VGG and positive bias voltage applied to VDD. Power supplies must be sequenced to apply VGG first, then VDD. When removing power, VDD must be turned off first, then VGG. VGG will draw very little current under small signal RF conditions, but as output power approaches the 1dB compression point, the VGG input will draw current up to several milliamps. The VGG supply must be capable of both sinking and sourcing this current. Assembly Recommended method of die attachment is AuSn eutectic. Wire bonding should be thermocompression bonding with no ultrasonics. To obtain full performance, RF input and output bond wires should be as short as possible. Wire length should be 7 mils maximum, with at least two wires per pad. Mounting the EMP216 on a "ridge" or pedestal is recommended to align the top surface of the MMIC to the interfacing substrate and minimize bond wire length. ESD warning The EMP216 is susceptible to damage from ESD and should only be handled in an ESD safe work station environment. Military and Hi-Rel screening Contact factory for military and hi-rel grades. DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 5 of 5 Revision 03 |
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